Fab Layout

The fab building consists of four primary levels –

• The Utility Level, which houses facilities equipment and power distribution panels
• The Sub Fab, containing manufacturing-specific systems such as vacuum pumps, chemical valve boxes, and life-safety systems
• The Cleanroom, where the tools required for chip production are located
• And the Interstitial and Fan Deck levels which provides ultra clean air to the cleanroom

The building has two sides: lithographic, where circuit patterns are etched into wafers, and non-lithographic, where other activities occur. The lithographic side's floor is made of extra-thick concrete and steel to protect sensitive equipment from vibrations.